BERGQUIST® GAP PAD® TGP 2000

Conhecido como Gap Pad® 2000S40

Características e Benefícios

This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
Ler mais

Informação Técnica

Capacidade de calor, ASTM E1269 0.6 J/g-K
Classificação da chama V-0
Condutividade térmica 2.0 W/mK
Constante dielétrica, @ 1kHz 6.0
Cor Cinza
Densidade 2.9 g/cm³
Dureza shore, Thirty second delay value, ASTM D2240 Borracha à granel Shore 00 30.0
Espessura padrão 0.508 - 3.175 mm
Resistividade volumétrica 1×10 Ohm m
Temperatura de operação -60.0 - 200.0 °C
Tensão de ruptura dielétrica 5000.0 Vac