BERGQUIST® GAP PAD® TGP 2000
Zināms kā Gap Pad® 2000S40
Iezīmes un ieguvumi
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
Apraksts
Dokumenti un lejupielādes
Meklējat TDL vai DDL citā valodā?
Tehniskā informācija
| Blīvums | 2.9 g/cm³ |
| Cietība, Thirty second delay value, ASTM D2240 Lielgabarīta gumija Shore 00 | 30.0 |
| Darbības temperatūra | -60.0 - 200.0 °C |
| Dielektriskā konstante, @ 1kHz | 6.0 |
| Dielektriskā sadalījuma spriegums | 5000.0 Vac |
| Krāsa | Pelēka |
| Liesmas novērtējums | V-0 |
| Siltuma jauda, ASTM E1269 | 0.6 J/g-K |
| Siltumvadītspēja | 2.0 W/mK |
| Standarta biezums | 0.508 - 3.175 mm |
| Tilpuma pretestība | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 2000
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.