BERGQUIST® GAP PAD® TGP 2000
Known as Gap Pad® 2000S40
Features and Benefits
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
- Thermal Conductivity: 2.0 W/m-K
- Low "S-Class" thermal resistance at very low pressures
- Designed for low-stress applications
- Highly conformable
- Low hardness
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Technical Information
| Color | Gray |
| Density | 2.9 g/cm³ |
| Dielectric breakdown voltage | 5000.0 Vac |
| Dielectric constant, @ 1kHz | 6.0 |
| Flame rating | V-0 |
| Heat capacity, ASTM E1269 | 0.6 J/g-K |
| Operating temperature | -60.0 - 200.0 °C |
| Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 | 30.0 |
| Standard thickness | 0.508 - 3.175 mm |
| Thermal conductivity | 2.0 W/mK |
| Volume resistivity | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 2000
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.