Electronics

Accelerating innovation in battery technology by integrating material application, battery system testing, digital simulation, and product development

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Discover Henkel’s innovations and material solutions for Electric Vehicles

Key challenges and solutions for EV power electronics and conversion systems

Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future SiC devices could extend this to 200°C. Thermal management of power electronics requires interfacing the package to a heat sink using a thermal interface material (TIM).

Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format

Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices.

Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material

Key challenges and solutions for EV battery systems