Battery Engineering Center Accelerating innovation in battery technology by integrating material application, battery system testing, digital simulation, and product development Read More
Whitepaper - Conductive Coatings: Enabling Dry Battery Cell Manufacturing Liquid gaskets help to prevent common gasket failures, such as gasket relaxation, displacement and flange bowing and deformation. Download Loctite Design Guide to learn the benefits of liquid gaskets. Read More
Henkel E-Mobility Solutions Discover Henkel’s innovations and material solutions for Electric Vehicles Read More
Low Pressure Molding Solutions Many electronic assemblies are exposed to extreme conditions, such as strong temperature swings, corrosive environmental media or high humidity. Nevertheless, these devices have to deliver the expected performance, despite difficult environmental conditions. While Henkel has various solutions in its portfolio for electronic component and assembly protection, one in particular is a special hotmelt used in the low pressure molding process. These innovative hotmelts, which Henkel markets under the TECHNOMELT® brand, have a broad range of uses and are now available for almost every application. With the low pressure molding process, it is possible not only to bond surfaces but also to provide protective encapsulation, even for small and delicate electronic components. Thanks to the use of renewable raw materials, hotmelts are more environmentally compatible than other products and are RoHS and WEEE-approved materials. Once the hotmelts are in direct contact ... Read More
EMI Shielding Solutions for Semiconductor Packages With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference (EMI). Radio-frequency (RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation. As electronics move toward miniaturization, lighter weight, and higher speeds, these challenges become more significant as conventional shielding methods present functional and operational limitations. To address this, the Faraday cage is applied directly at the package level. This webinar will cover Henkel’s latest materials, application process, test methods, and performance. Authors: Jinu Choi, Xinpei Cao, Dan Maslyk Read More
Smart Card Market Trends and Integrated Adhesive Solutions The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructure implementations, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control. Smart Cards, however, are only as good as the reliability provided by the materials that enable their production. Selecting the most effective adhesive solutions that exceed stringent manufacturing and end-use requirement is essential. This webinar will present information about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability. Jinu Choi is a Market Development Manager at Henkel Electronic Materials responsible for global product strategy and business development of advanced materials. Author: Jinu Choi Read More
Henkel Dual Cure Adhesives Enables Camera Module Success The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate. Read More
Customizable Silicone Materials for MEMS and Semiconductor Packages Micro Electro Mechanical Systems (MEMS) are driving the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector which is driving MEMS growth, smartphones today can contain as many as ten to twelve — or even more — MEMS devices, with this number projected to grow in the coming years. Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive’s modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, Henkel has developed a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique... Read More
