LOCTITE® ABLESTIK 5025E
功能與優點
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.
For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver-filled electrically conductive thin-film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements.
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技術資訊
| 剪切強度, 鋁 | 2000.0 psi |
| 固化類型 | 熱固化 |
| 導熱性 | 6.5 W/mK |
| 建議固化方式, @ 150.0 °C | 30.0 分 |
| 機構批准/證書/規格 | MIL 標準 883 (方法 5011) |
| 物理形態 | 薄膜 |
| 玻璃化溫度(Tg) | 90.0 °C |
LOCTITE® ABLESTIK 5025E
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.