LOCTITE® ABLESTIK 5025E
Features and Benefits
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.
For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver-filled electrically conductive thin-film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements.
- Thin, uniform bondline control
- Silver filled
- RF/EMI shielding
- Electrically conductive in x, y and z axes
Documents and Downloads
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Technical Information
| Agency approvals / certificates / specifications | MIL standard 883 (method 5011) |
| Cure schedule, @ 150.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 90.0 °C |
| Physical form | Film |
| Shear strength, Aluminum | 2000.0 psi |
| Thermal conductivity | 6.5 W/mK |
LOCTITE® ABLESTIK 5025E
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.