LOCTITE® ABLESTIK 5025E
특징 및 이점
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.
For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver-filled electrically conductive thin-film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements.
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문서 및 다운로드
다른 언어로 작성된 TDS 또는 SDS를 찾고 계신가요?
기술 정보
| 경화 방식 | 열경화 |
| 경화 시간, @ 150.0 °C | 30.0 분 |
| 물리적 형태 | 필름 |
| 에이전시 승인서 / 인증서 / 사양서 | MIL Standard 883 (Method 5011) |
| 열전도율 | 6.5 W/mK |
| 유리전이온도(Tg) | 90.0 °C |
| 전단 강도, 알류미늄 | 2000.0 psi |
LOCTITE® ABLESTIK 5025E
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.