LOCTITE® ECCOBOND FP0087
功能与优点
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.
LOCTITE® ECCOBOND FP0087 is a single component potting product with low thermal expansion. This product therefore provides excellent thermal shock resistance and reduced warpage and cracking.The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.
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技术信息
| 保质期 | 9.0 月 |
| 固化方式 | 热+紫外线 |
| 应用 | 封装 |
| 热膨胀系数 (CTE), Below Tg | 18.0 ppm/°C |
| 粘度，博勒菲 - RVF, @ 25.0 °C Spindle 6, speed 20 rpm | 20000.0 mPa.s (cP) |
| 组分数量 | 单组份 |
| 肖氏硬度, Shore D | 95.0 |
| 颜色 | 黑色 |
LOCTITE® ECCOBOND FP0087
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.