LOCTITE® ECCOBOND FP0087
功能與優點
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.
LOCTITE® ECCOBOND FP0087 is a single component potting product with low thermal expansion. This product therefore provides excellent thermal shock resistance and reduced warpage and cracking.The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.
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技術資訊
| 保質期 | 9.0 月 |
| 固化類型 | 熱固化 |
| 應用 | 封裝 |
| 熱膨脹係數 (CTE), Below Tg | 18.0 ppm/°C |
| 粘度，Brookfield - RVF, @ 25.0 °C Spindle 6, speed 20 rpm | 20000.0 mPa.s (cP) |
| 肖氏硬度, Shore D | 95.0 |
| 零組件數 | 1 組分 |
| 顏色 | 黑色 |
LOCTITE® ECCOBOND FP0087
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.