LOCTITE® ECCOBOND FP0087
Features and Benefits
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.
LOCTITE® ECCOBOND FP0087 is a single component potting product with low thermal expansion. This product therefore provides excellent thermal shock resistance and reduced warpage and cracking.The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.
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Technical Information
| Applications | Encapsulating |
| Coefficient of thermal expansion (CTE), Below Tg | 18.0 ppm/°C |
| Colour | Black |
| Cure type | Heat cure |
| Number of components | 1 part |
| Shelf life | 9.0 mon. |
| Shore hardness, Shore D | 95.0 |
| Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 20 rpm | 20000.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP0087
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.