LOCTITE® ABLESTIK QMI546
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LOCTITE ABLESTIK QMI546, BMI, Die attach
LOCTITE® ABLESTIK QMI546 die attach adhesive is formulated to cure rapidly below the boiling point of water, preventing steam from creating voids. This product is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives
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Tehnične informacije
| Koeficient toplotnega raztezanja (CTE), Above Tg | 190.0 ppm/°C |
| Koeficient toplotnega raztezanja (CTE), Below Tg | 80.0 ppm/°C |
| Način strjevanja | Strjevanje na podlagi toplote |
| Primeri uporabe | Pritrjevalniki |
| Temperatura posteklenitve (Tg) | 10.0 °C |
| Tiksotropni indeks | 6.0 |
| Toplotna prevodnost | 0.2 W/mK |
| Viskoznost | 6500.0 mPa.s (cP) |
LOCTITE® ABLESTIK QMI546
LOCTITE ABLESTIK QMI546, BMI, Die attach