LOCTITE® ABLESTIK QMI546
Features and Benefits
LOCTITE ABLESTIK QMI546, BMI, Die attach
LOCTITE® ABLESTIK QMI546 die attach adhesive is formulated to cure rapidly below the boiling point of water, preventing steam from creating voids. This product is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives
- Non-conductive
- Stable at high temperatures
- Hydrophobic
- Void-free bondline
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE), Above Tg | 190.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 80.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 10.0 °C |
| Thermal conductivity | 0.2 W/mK |
| Thixotropic index | 6.0 |
| Viscosity | 6500.0 mPa·s (cP) |
LOCTITE® ABLESTIK QMI546
LOCTITE ABLESTIK QMI546, BMI, Die attach