LOCTITE® ABLESTIK 508

Features and Benefits

LOCTITE ABLESTIK 508, Epoxy Film, Assembly, Thermoplastic Adhesive
LOCTITE® ABLESTIK 508 thermoplastic adhesive is designed to provide a temporary bond in ceramic chip or ferrite dicing applications. Parts bonded with LOCTITE ABLESTIK 508 adhesive film may be separated by reheating or immersion in a solvent such as acetone, MEK, or tetrahydrofuran
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Technical Information

Cure schedule, @ 125.0 °C 15.0 min.
Cure type Heat cure
Physical form Film
Shear strength, Aluminum 4003.0 psi