LOCTITE® ABLESTIK 508
Omadused ja eelised
LOCTITE ABLESTIK 508, Epoxy Film, Assembly, Thermoplastic Adhesive
LOCTITE® ABLESTIK 508 thermoplastic adhesive is designed to provide a temporary bond in ceramic chip or ferrite dicing applications. Parts bonded with LOCTITE ABLESTIK 508 adhesive film may be separated by reheating or immersion in a solvent such as acetone, MEK, or tetrahydrofuran
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Dokumendid ja allalaadimised
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Tehniline teave
| Füüsiline vorm | Kile |
| Kõvenemisaeg, @ 125.0 °C | 15.0 minut |
| Nihkejõud, Alumiinium | 4003.0 psi |
| Tahkumistüüp | Kuumkõvenemine |
LOCTITE® ABLESTIK 508
LOCTITE ABLESTIK 508, Epoxy Film, Assembly, Thermoplastic Adhesive