LOCTITE® ABLESTIK 508
Características y Ventajas
LOCTITE ABLESTIK 508, Epoxy Film, Assembly, Thermoplastic Adhesive
LOCTITE® ABLESTIK 508 thermoplastic adhesive is designed to provide a temporary bond in ceramic chip or ferrite dicing applications. Parts bonded with LOCTITE ABLESTIK 508 adhesive film may be separated by reheating or immersion in a solvent such as acetone, MEK, or tetrahydrofuran
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Información técnica
| Forma Física | Película |
| Programa de curado, @ 125.0 °C | 15.0 min |
| Resistencia al corte, Aluminio | 4003.0 psi |
| Tipo de curado | Curado Térmico |
LOCTITE® ABLESTIK 508
LOCTITE ABLESTIK 508, Epoxy Film, Assembly, Thermoplastic Adhesive