LOCTITE® ECCOBOND FP4802
Known as FP4802 30CC SEMCO 50.4G -40CD
Features and Benefits
LOCTITE ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).
LOCTITE® ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).
- High purity
- Excellent flow
- High temperature
Documents and Downloads
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 100.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 20.0 ppm/°C |
| Extractable ionic content, Chloride (CI-) | 5.0 ppm |
| Extractable ionic content, Potassium (K+) | 5.0 ppm |
| Extractable ionic content, Sodium (Na+) | 5.0 ppm |
| Glass transition temperature (Tg) | 50.0 °C |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield - HBT, @ 25.0 °C Spindle 7, speed 10 rpm | 80000.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP4802
LOCTITE ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).