LOCTITE® ECCOBOND FP4802
Connu sous le nom de FP4802 30CC SEMCO 50.4G -40CD
Caractéristiques et avantages
This black, high-purity encapsulant is designed for applications utilizing lead-free solder. It's suitable for protecting bare chips in a variety of advanced packages.
LOCTITE® ECCOBOND FP4802 is a black, high-purity coating liquid for encapsulating lead-free solder applications. It’s suitable for bare chip protection of a variety of advanced packages, such as BGAs (Ball Grid Arrays), CSPs (Chip Scale Packages), PBGAs (Plastic Ball Grid Arrays) and full-arrays on LTCC (low-temperature co-fired ceramic). It’s designed to meet the “green” non-halide objectives of many technical users. Its excellent flow properties allow it to penetrate fine-pitch wires and deep cavities—without entrapping voids. A cavity or potting dam encapsulant is required for flow control. LOCTITE ECCOBOND FP4802 is formulated with an epoxy-based resin and cures when exposed to heat.
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Informations techniques
| Coefficient de dilatation thermique (CDT), Above Tg | 100.0 ppm/°C |
| Coefficient de dilatation thermique (CDT), Below Tg | 20.0 ppm/°C |
| Température de stockage | -40.0 °C |
| Température de transition vitreuse | 50.0 °C |
| Teneur ionique extractible, Chlorure (Cl) | 5.0 ppm |
| Teneur ionique extractible, Potassium (K+) | 5.0 ppm |
| Teneur ionique extractible, Sodium (Na+) | 5.0 ppm |
| Viscosité, Brookfield - HBT, @ 25.0 °C Spindle 7, speed 10 rpm | 80000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4802
This black, high-purity encapsulant is designed for applications utilizing lead-free solder. It's suitable for protecting bare chips in a variety of advanced packages.