LOCTITE® ECCOBOND FP4802
Γνωστό ως FP4802 30CC SEMCO 50.4G -40CD
Χαρακτηριστικά και οφέλη
LOCTITE ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).
LOCTITE® ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).
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Έγγραφα και λήψεις
Ψάχνετε για TDS ή SDS σε άλλη γλώσσα;
Τεχνικές πληροφορίες
| Lämpölaajenemiskerroin (CTE), Above Tg | 100.0 ppm/°C |
| Lämpölaajenemiskerroin (CTE), Below Tg | 20.0 ppm/°C |
| Εκχυλίσιμο ιοντικό περιεχόμενο, Κάλιο (K+) | 5.0 ppm |
| Εκχυλίσιμο ιοντικό περιεχόμενο, Νάτριο (Na+) | 5.0 ppm |
| Εκχυλίσιμο ιοντικό περιεχόμενο, Χλωριούχο (CI-) | 5.0 ppm |
| Θερμοκρασία αποθήκευσης | -40.0 °C |
| Ιξώδες, Brookfield - HBT, @ 25.0 °C Spindle 7, speed 10 rpm | 80000.0 mPa.s (cP) |
| Σημείο υαλώδους μετάπτωσης | 50.0 °C |
LOCTITE® ECCOBOND FP4802
LOCTITE ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).