LOCTITE® ECCOBOND FP4802
Tuntud kui FP4802 30CC SEMCO 50.4G -40CD
Omadused ja eelised
slide 1 of 1
A 1-part, black, high-purity encapsulant designed for applications utilizing lead-free solder. It's suitable for protecting bare chips in a variety of advanced packages.
LOCTITE® ECCOBOND FP4802 is a black, high-purity liquid encapsulant specially designed for use in applications utilizing lead-free solder. It was formulated to meet the non-halide objectives of many technical users and for temperature cycling ranges up to-65 to 150°C (-40°F to 302°F). It features excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. It is ideal for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGAs), Chip Scale Packages (CSPs), Plastic Ball Grid Arrays (PBGAs), and full arrays on Low Temperature cofired Ceramic (LTCC).
Lugege rohkem
Dokumendid ja allalaadimised
Otsite TDS-i või SDS-i teises keeles?
Tehniline teave
| Ekstraheeritav ioonisisu, Kaalium (K+) | 5.0 ppm |
| Ekstraheeritav ioonisisu, Kloriid (CI-) | 5.0 ppm |
| Ekstraheeritav ioonisisu, Naatrium (Na+) | 5.0 ppm |
| Klaasistumistemperatuur (Tg) | 50.0 °C |
| Soojuspaisumise koefitsient (CTE), Above Tg | 100.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Below Tg | 20.0 ppm/°C |
| Säilitustemperatuur | -40.0 °C |
| Viskoossus, Brookfield - HBT, @ 25.0 °C Spindle 7, speed 10 rpm | 80000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4802
A 1-part, black, high-purity encapsulant designed for applications utilizing lead-free solder. It's suitable for protecting bare chips in a variety of advanced packages.