LOCTITE® ECCOBOND FP4802
Tuntud kui FP4802 30CC SEMCO 50.4G -40CD
Omadused ja eelised
LOCTITE ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).
LOCTITE® ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).
Lugege rohkem
Dokumendid ja allalaadimised
Otsite TDS-i või SDS-i teises keeles?
Tehniline teave
| Ekstraheeritav ioonisisu, Kaalium (K+) | 5.0 ppm |
| Ekstraheeritav ioonisisu, Kloriid (CI-) | 5.0 ppm |
| Ekstraheeritav ioonisisu, Naatrium (Na+) | 5.0 ppm |
| Klaasistumistemperatuur (Tg) | 50.0 °C |
| Soojuspaisumise koefitsient (CTE), Above Tg | 100.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Below Tg | 20.0 ppm/°C |
| Säilitustemperatuur | -40.0 °C |
| Viskoossus, Brookfield - HBT, @ 25.0 °C Spindle 7, speed 10 rpm | 80000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4802
LOCTITE ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).