LOCTITE® ECCOBOND FP4802
Known as FP4802 30CC SEMCO 50.4G -40CD
Features and Benefits
A 1-part, black, high-purity encapsulant designed for applications utilizing lead-free solder. It's suitable for protecting bare chips in a variety of advanced packages.
LOCTITE® ECCOBOND FP4802 is a black, high-purity liquid encapsulant specially designed for use in applications utilizing lead-free solder. It was formulated to meet the non-halide objectives of many technical users and for temperature cycling ranges up to-65 to 150°C (-40°F to 302°F). It features excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. It is ideal for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGAs), Chip Scale Packages (CSPs), Plastic Ball Grid Arrays (PBGAs), and full arrays on Low Temperature cofired Ceramic (LTCC).
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 100.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 20.0 ppm/°C |
| Extractable ionic content, Chloride (CI-) | 5.0 ppm |
| Extractable ionic content, Potassium (K+) | 5.0 ppm |
| Extractable ionic content, Sodium (Na+) | 5.0 ppm |
| Glass transition temperature (Tg) | 50.0 °C |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield - HBT, @ 25.0 °C Spindle 7, speed 10 rpm | 80000.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP4802
A 1-part, black, high-purity encapsulant designed for applications utilizing lead-free solder. It's suitable for protecting bare chips in a variety of advanced packages.