LOCTITE® 3517M
Features and Benefits
One-part, reworkable epoxy underfill for CSP and BGA production.
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M™ is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M™ is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Technical Information
| Coefficient of thermal expansion (CTE) | 65.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 191.0 ppm/°C |
| Cure schedule light intensity | 30.0 mW/cm² |
| Cure schedule, Recommended @ 120.0 °C | 5.0 min. |
| Glass transition temperature (Tg) | 78.0 °C |
| Viscosity, Haake PK1.2 | 2600.0 mPa·s (cP) |
LOCTITE® 3517M
One-part, reworkable epoxy underfill for CSP and BGA production.