LOCTITE® ABLESTIK 84-1LMISR4
Omadused ja eelised
This epoxy-based electrically conductive die-attach adhesive is perfect for small component assembly.
LOCTITE® ABLESTIK 84-1LMISR4 is a silver, electrically conductive die-attach adhesive for high-throughput, automated equipment. Its rigid nature allows minimum adhesive dispense and die put-down dwell time without tailing or stringing problems. It’s formulated with an epoxy-based resin and cures when exposed to heat. This is one of the most widely used die-attach adhesives in the semiconductor industry—and for good reason.
Lugege rohkem
Dokumendid ja allalaadimised
Otsite TDS-i või SDS-i teises keeles?
Tehniline teave
| Ekstraheeritav ioonisisu, Kaalium (K+) | 10.0 ppm |
| Ekstraheeritav ioonisisu, Kloriid (CI-) | 20.0 ppm |
| Ekstraheeritav ioonisisu, Naatrium (Na+) | 10.0 ppm |
| Füüsiline vorm | Pasta |
| Klaasistumistemperatuur (Tg) | 120.0 °C |
| Komponentide arv | 1-komponentne |
| Kõvenemisaeg, @ 175.0 °C | 1.0 tund |
| Mahu resistiivsus | ≤ 0.0002 Ohm cm |
| Niiskuse imendumine, 168 hr. @ 85°C/85% RH | 0.6 % |
| Pealekandmismeetod | Doseerimissüsteem |
| Rakendused | Stantskinnitus |
| Soojusjuhtivus | 2.5 W/mK |
| Soojuspaisumise koefitsient (CTE) | 40.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Above Tg | 150.0 ppm/°C |
| Soovitatav kasutada koos | Juhtmekorpus: hõbe, Juhtmekorpus: kuld |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 5.6 |
| Tõmbemoodul, @ 250.0 °C | 300.0 N/mm² (44000.0 psi ) |
| Viskoossus, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 8000.0 mPa.s (cP) |
| Värvus | Hõbedane |
LOCTITE® ABLESTIK 84-1LMISR4
This epoxy-based electrically conductive die-attach adhesive is perfect for small component assembly.