LOCTITE® ABLESTIK 84-1LMISR4
Features and Benefits
This epoxy-based electrically conductive die-attach adhesive is perfect for small component assembly.
LOCTITE® ABLESTIK 84-1LMISR4 is a silver, electrically conductive die-attach adhesive for high-throughput, automated equipment. Its rigid nature allows minimum adhesive dispense and die put-down dwell time without tailing or stringing problems. It’s formulated with an epoxy-based resin and cures when exposed to heat. This is one of the most widely used die-attach adhesives in the semiconductor industry—and for good reason.
- Offers excellent dispensability
- Box oven cure
- Requires minimum dispense
- Offers a long work life
Documents and Downloads
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Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 40.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 150.0 ppm/°C |
| Colour | Silver |
| Cure schedule, @ 175.0 °C | 1.0 hr. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 20.0 ppm |
| Extractable ionic content, Potassium (K+) | 10.0 ppm |
| Extractable ionic content, Sodium (Na+) | 10.0 ppm |
| Glass transition temperature (Tg) | 120.0 °C |
| Moisture absorption, 168 hr. @ 85°C/85% RH | 0.6 % |
| Number of components | 1 part |
| Physical form | Paste |
| Recommended for use with | LeadFrame: gold, LeadFrame: silver |
| Tensile modulus, @ 250.0 °C | 300.0 N/mm² (44000.0 psi ) |
| Thermal conductivity | 2.5 W/mK |
| Thixotropic index | 5.6 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 8000.0 mPa·s (cP) |
| Volume resistivity | ≤ 0.0002 Ohm cm |
LOCTITE® ABLESTIK 84-1LMISR4
This epoxy-based electrically conductive die-attach adhesive is perfect for small component assembly.