LOCTITE® ABLESTIK ABP 8151 D7
功能与优点
LOCTITE ABLESTIK ABP 8151D7, Silicone, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 8151D7 non-conductive die attach adhesive is designed for MEMs package applications.
了解更多
技术信息
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 12000.0 mPa.s (cP) |
| 触变指数 | 3.5 |
LOCTITE® ABLESTIK ABP 8151 D7
LOCTITE ABLESTIK ABP 8151D7, Silicone, Die Attach, Non-conductive Adhesive