LOCTITE® ABLESTIK ABP 8151 D7
Features and Benefits
LOCTITE ABLESTIK ABP 8151D7, Silicone, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 8151D7 non-conductive die attach adhesive is designed for MEMs package applications.
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Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Thixotropic index | 3.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 12000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 8151 D7
LOCTITE ABLESTIK ABP 8151D7, Silicone, Die Attach, Non-conductive Adhesive