LOCTITE® ABLESTIK 8380
功能与优点
LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated to increase assembly productivity and yield. The rheology of LOCTITE ABLESTIK 8380 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. It is ideal for high speed automated die bonders. The adhesive can be dispensed with minimum dwell time, without tailing or stringing, to maximize die bonder UPH. Please refer to the TDS for alternate cure schedules.
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技术信息
| RT 模剪切强度, 2 x 2 mm Si die on silver plated copper leadframe | 13.5 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 100.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 10.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 10.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 热膨胀系数 (CTE) | 56.0 ppm/°C |
LOCTITE® ABLESTIK 8380
LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive