LOCTITE® ABLESTIK 8380
特長および利点
LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated to increase assembly productivity and yield. The rheology of LOCTITE ABLESTIK 8380 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. It is ideal for high speed automated die bonders. The adhesive can be dispensed with minimum dwell time, without tailing or stringing, to maximize die bonder UPH. Please refer to the TDS for alternate cure schedules.
詳細はこちら
技術情報
| RTダイせん断強度, 2 x 2 mm Si die on silver plated copper leadframe | 13.5 kg-f |
| アプリケーション(用途) | ダイ接着剤 |
| 抽出可能なイオン含有量, カリウム(K+) | 10.0 ppm |
| 抽出可能なイオン含有量, ナトリウム(Na+) | 10.0 ppm |
| 抽出可能なイオン含有量, 塩化物 (CI-) | 100.0 ppm |
| 熱膨張率 | 56.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
LOCTITE® ABLESTIK 8380
LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive