LOCTITE® ABLESTIK 8380

Caractéristiques et avantages

LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated to increase assembly productivity and yield. The rheology of LOCTITE ABLESTIK 8380 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. It is ideal for high speed automated die bonders. The adhesive can be dispensed with minimum dwell time, without tailing or stringing, to maximize die bonder UPH. Please refer to the TDS for alternate cure schedules.
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Informations techniques

Applications Soudage de puce
Coefficient de dilatation thermique (CDT) 56.0 ppm/°C
Résistance au cisaillement puce RT, 2 x 2 mm Si die on silver plated copper leadframe 13.5 kg-f
Teneur ionique extractible, Chlorure (Cl) 100.0 ppm
Teneur ionique extractible, Potassium (K+) 10.0 ppm
Teneur ionique extractible, Sodium (Na+) 10.0 ppm
Type de polymérisation Polymérisation par la chaleur