LOCTITE® ABLESTIK 8380
Features and Benefits
LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated to increase assembly productivity and yield. The rheology of LOCTITE ABLESTIK 8380 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. It is ideal for high speed automated die bonders. The adhesive can be dispensed with minimum dwell time, without tailing or stringing, to maximize die bonder UPH. Please refer to the TDS for alternate cure schedules.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 56.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 100.0 ppm |
| Extractable ionic content, Potassium (K+) | 10.0 ppm |
| Extractable ionic content, Sodium (Na+) | 10.0 ppm |
| RT die shear strength, 2 x 2 mm Si die on silver plated copper leadframe | 13.5 kg-f |
LOCTITE® ABLESTIK 8380
LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive