BERGQUIST® SIL PAD® TSP 1800
Known as Sil-Pad® 1200
Features and Benefits
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.
BERGQUIST® SIL PAD TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. It exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw- and clip-mounted applications.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Additional Documents
Technical Information
| Carrier type | Glass Fibre |
| Colour | Black |
| Flame rating | V-0 |
| Standard thickness | 0.229 - 0.406 mm |
| Thermal conductivity | 1.8 W/mK |
BERGQUIST® SIL PAD® TSP 1800
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.