BERGQUIST® SIL PAD® TSP 1800
Známé jako Sil-Pad® 1200
Vlastnosti a výhody
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.
BERGQUIST® SIL PAD TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. It exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw- and clip-mounted applications.
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Technické informace
| Barva | Černá |
| Hodnocení hořlavosti | V-0 |
| Standardní tloušťka | 0.229 - 0.406 mm |
| Tepelná vodivost | 1.8 W/mK |
| Typ přepravce | Skleněná vlákna |
BERGQUIST® SIL PAD® TSP 1800
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.