BERGQUIST SIL PAD TSP 1800
Known as Sil-Pad® 1200
Features and Benefits
Thermally conductive, fiberglass-reinforced, silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.
BERGQUIST® SIL PAD TSP 1800 is a silicone based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. BERGQUIST SIL PAD TSP 1800 exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw and clip mounted applications. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Technical Information
| Carrier type | Fiberglass |
| Color | Black |
| Flame rating | V-0 |
| Standard thickness | 0.229 - 0.406 mm |
| Thermal conductivity | 1.8 W/mK |
BERGQUIST SIL PAD TSP 1800
Thermally conductive, fiberglass-reinforced, silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.