BERGQUIST® SIL PAD TSP 1800
Conhecido como Sil-Pad® 1200
Características e Benefícios
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.
BERGQUIST® SIL PAD TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. It exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw- and clip-mounted applications.
Ler mais
Documentos e Downloads
Procurando por um TDS ou MSDS / FISPQ em outro idioma?
Documentação Adicional
Informação Técnica
| Classificação da chama | V-0 |
| Condutividade térmica | 1.8 W/mK |
| Cor | Preto |
| Espessura padrão | 0.229 - 0.406 mm |
| Tipo de operadora | Fibra de Vidro |
BERGQUIST® SIL PAD TSP 1800
Thermally conductive, fiberglass-reinforced silicone insulator pad with exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.