LOCTITE® ABLESTIK ME 990
Features and Benefits
LOCTITE ABLESTIK ME 990, Epoxy, Encapsulant
LOCTITE® ABLESTIK ME 990 is designed for die bonding and other assembly applications where electrical conductivity is not required.
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Documents and Downloads
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Technical Information
| Applications | Encapsulating |
| Cure schedule, @ 165.0 °C | 1.0 hr. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Operating temperature | -40.0 - 125.0 °C |
| Viscosity, Brookfield, ASTM D2393 | 50000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ME 990
LOCTITE ABLESTIK ME 990, Epoxy, Encapsulant