LOCTITE® ABLESTIK 561K
功能與優點
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion.
When you’re working with applications where CTE mismatch is an issue, try LOCTITE® ABLESTIK 561K. This film adhesive is electrically insulating, high strength, and specially designed for substrate attach and heat sink bonding – especially when materials are severely mismatched in terms of coefficients of thermal expansion. Please note data and results will vary with different thicknesses.
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技術資訊
| 介電常數, @ 1kHz | 5.7 |
| 剪切強度, 鋁 | 3300.0 psi |
| 固化類型 | 熱固化 |
| 導熱性 | 0.9 W/mK |
| 建議固化方式, @ 150.0 °C | 30.0 分 |
| 物理形態 | 薄膜 |
| 玻璃化溫度(Tg) | 55.0 °C |
| 載體類型 | 玻璃纖維織物 |
LOCTITE® ABLESTIK 561K
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion.