LOCTITE® ABLESTIK 561K
特長および利点
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion.
When you’re working with applications where CTE mismatch is an issue, try LOCTITE® ABLESTIK 561K. This film adhesive is electrically insulating, high strength, and specially designed for substrate attach and heat sink bonding – especially when materials are severely mismatched in terms of coefficients of thermal expansion. Please note data and results will vary with different thicknesses.
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技術情報
| せん断強度, アルミニウム | 3300.0 psi |
| ガラス転移温度 (Tg) | 55.0 °C |
| キャリアタイプ | ガラス布 |
| 外観 | フィルム |
| 熱伝導率 | 0.9 W/mK |
| 硬化スケジュール, @ 150.0 °C | 30.0 分 |
| 硬化タイプ | 熱硬化 |
| 誘電率, @ 1kHz | 5.7 |
LOCTITE® ABLESTIK 561K
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion.