LOCTITE® ABLESTIK 561K
Características y Ventajas
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion.
When you’re working with applications where CTE mismatch is an issue, try LOCTITE® ABLESTIK 561K. This film adhesive is electrically insulating, high strength, and specially designed for substrate attach and heat sink bonding – especially when materials are severely mismatched in terms of coefficients of thermal expansion. Please note data and results will vary with different thicknesses.
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Información técnica
| Conductividad térmica | 0.9 W/mK |
| Constante dieléctrica, @ 1kHz | 5.7 |
| Esfuerzo de corte, Aluminio | 3300.0 psi |
| Forma física | Película |
| Programa de curado, @ 150.0 °C | 30.0 min |
| Temperatura de transición vítrea (Tg) | 55.0 °C |
| Tipo de curado | Curado Térmico |
| Tipo de portador | Tejido de fibra de vidrio |
LOCTITE® ABLESTIK 561K
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion.