LOCTITE® ABLESTIK 561K
특징 및 이점
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion.
When you’re working with applications where CTE mismatch is an issue, try LOCTITE® ABLESTIK 561K. This film adhesive is electrically insulating, high strength, and specially designed for substrate attach and heat sink bonding – especially when materials are severely mismatched in terms of coefficients of thermal expansion. Please note data and results will vary with different thicknesses.
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기술 정보
| 경화 방식 | 열경화 |
| 경화 시간, @ 150.0 °C | 30.0 분 |
| 물리적 형태 | 필름 |
| 열전도율 | 0.9 W/mK |
| 유리전이온도(Tg) | 55.0 °C |
| 유전율, @ 1kHz | 5.7 |
| 전단 강도, 알류미늄 | 3300.0 psi |
| 캐리어 유형 | 유리 직물 |
LOCTITE® ABLESTIK 561K
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion.