LOCTITE® ABLESTIK CE 3920
被稱為 CE-3920
功能與優點
This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.
LOCTITE® ABLESTIK CE 3920 is a silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It’s a low-viscosity, low-CTE and Pb-free alternative to solder with a long work life for minimal product waste and clean-up time. LOCTITE® ABLESTIK CE 3920 is formulated with an epoxy-based resin, cures fast when exposed to heat and doesn’t require any post-cure.
瞭解更多
技術資訊
| 儲存溫度 | -40.0 °C |
| 固化類型 | 熱固化 |
| 建議固化方式, @ 150.0 °C | 5.0 分 |
| 粘度，錐型和板型, Angle 3° Speed 5 rpm | 26100.0 mPa.s (cP) |
| 觸變指數 | 5.7 |
| 零組件數 | 1 組分 |
| 體積電阻率, @ 25.0 °C sample cured 5 min. @150 °C | 0.0003 Ohm cm |
LOCTITE® ABLESTIK CE 3920
This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.