LOCTITE® ABLESTIK 8301

被稱為 ABLEBOND 8301 (39G)

功能與優點

This electrically conductive die attach adhesive is specially designed for high reliability package applications.
LOCTITE® ABLESTIK 8301 is an electrically conductive die attach adhesive designed for high reliability package applications. It is snap curable, low stress and high reliability. You can expect improved JEDEC performance and usability for a wide range of package sizes. Ideal for PPF, bare copper and silver.
瞭解更多

技術資訊

RT 模剪切強度 2.0 kg-f
可萃取出的離子含量, 氯化物(CI-) 9.0 ppm
可萃取出的離子含量, 鈉(Na+) 9.0 ppm
可萃取出的離子含量, 鉀(K+) 5.0 ppm
固化類型 熱固化
建議推廣應用 導線架:金, 導線架:銀
應用 晶片焊接
拉伸模量, @ 250.0 °C 60.0 N/mm² (8700.0 psi )
熱模剪切強度 15.0 kg-f
物理形態 黏貼
零組件數 1 組分