LOCTITE® ABLESTIK 8301
Features and Benefits
This epoxy-based, electrically conductive die-attach adhesive is specially designed for high-reliability packaging applications.
LOCTITE® ABLESTIK 8301 is a silver, electrically conductive die-attach adhesive for high-reliability packaging applications, suitable for a wide range of substrates (PPF, bare copper and silver) and package sizes. It’s formulated with an epoxy hybrid resin, cures snappy when exposed to heat and demonstrates low stress and improved hot/wet die shear strength.
- Snap curable
- Low stress
- High reliability
- Suitable for a wide range of package sizes
- Improved JEDEC performance
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 5.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 15.0 kg-f |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength | 2.0 kg-f |
| Recommended for use with | LeadFrame: gold, LeadFrame: silver |
| Tensile modulus, @ 250.0 °C | 60.0 N/mm² (8700.0 psi ) |
LOCTITE® ABLESTIK 8301
This epoxy-based, electrically conductive die-attach adhesive is specially designed for high-reliability packaging applications.