LOCTITE® ABLESTIK 8301
Known as ABLEBOND 8301 (39G)
Features and Benefits
This electrically conductive die attach adhesive is specially designed for high reliability package applications.
LOCTITE® ABLESTIK 8301 is an electrically conductive die attach adhesive designed for high reliability package applications. It is snap curable, low stress and high reliability. You can expect improved JEDEC performance and usability for a wide range of package sizes. Ideal for PPF, bare copper and silver.
- Electrically conductive
- Snap curable
- Low stress
- Thermally conductive
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 5.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 15.0 kg-f |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength | 2.0 kg-f |
| Recommended for use with | LeadFrame: gold, LeadFrame: silver |
| Tensile modulus, @ 250.0 °C | 60.0 N/mm² (8700.0 psi ) |
LOCTITE® ABLESTIK 8301
This electrically conductive die attach adhesive is specially designed for high reliability package applications.