LOCTITE® ECCOBOND E 1216M
功能与优点
Fast-flowing and void-free epoxy underfill with excellent adhesion and strength for high-volume assembly operations.
If you’re looking for an underfill that can handle high-volume assembly operations where fast-flow filling is required, LOCTITE® ECCOBOND E 1216M is a great pick. Our ECCOBOND E 1216M composite cures entirely in a single reflow cycle but is stable enough to be easily shipped and used in large-volume cartridges (up to 20oz). This black, epoxy-based underfill is ideal for those who prefer to work with anhydride-free products, as it’s specifically formulated to eliminate anhydride-type curing agents.
了解更多
技术信息
| 热膨胀系数 (CTE), Above Tg | 131.0 ppm/°C |
| 热膨胀系数 (CTE), Below Tg | 35.0 ppm/°C |
| 玻璃化温度 (Tg) | 125.0 °C |
| 粘度，博勒菲, Spindle 4, speed 20 rpm | 4000.0 mPa.s (cP) |
| 适用时间 | 5.0 天 |
LOCTITE® ECCOBOND E 1216M
Fast-flowing and void-free epoxy underfill with excellent adhesion and strength for high-volume assembly operations.