LOCTITE® ABLESTIK 8008HT
被称为 ABLECOAT 8008HT
功能与优点
LOCTITE ABLESTIK 8008HT, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 8008HT adhesive is designed for high power devices in high UPH environment. It offers a lead-free alternative to soft solder and eutectic and can potentially reduce the layers of backside metallization required. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008HT should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.
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技术信息
| RT 模剪切强度, 2 x 2 mm Si die on Cu leadframe | 6.0 kg-f |
| 体积电阻率 | 0.00005 Ohm cm |
| 可萃取出的离子含量, 氯化物 (CI-) | 9.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 9.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 9.0 ppm |
| 固化方式 | 热+紫外线 |
| 固化时间, Snap Cure @ 170.0 °C | 20.0 秒 |
| 导热性 | 11.0 W/mK |
| 应用 | 芯片焊接 |
| 拉伸模量, @ 250.0 °C | 2451.0 N/mm² (355340.0 psi ) |
| 热模剪切强度, @ 260.0 °C 2 x 2 mm Si die on Cu LF | 2.6 kg-f |
| 热膨胀系数 (CTE) | 37.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 62.0 ppm/°C |
| 玻璃化温度 (Tg) | 264.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 50000.0 mPa.s (cP) |
| 触变指数 | 4.0 |
| 颜色 | 银 |
LOCTITE® ABLESTIK 8008HT
LOCTITE ABLESTIK 8008HT, Proprietary Hybrid Chemistry, Die Attach