LOCTITE® ABLESTIK 3119
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LOCTITE ABLESTIK 3119, Epoxy, Bonding
LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive. Please refer to the TDS for alternate cure schedules.
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Tehnične informacije
| Način strjevanja | Strjevanje na podlagi toplote |
| Temperatura posteklenitve (Tg) | 110.0 °C |
LOCTITE® ABLESTIK 3119
LOCTITE ABLESTIK 3119, Epoxy, Bonding