LOCTITE® ABLESTIK 3119
Elementi i pogodnosti
LOCTITE ABLESTIK 3119, Epoxy, Bonding
LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive. Please refer to the TDS for alternate cure schedules.
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Dokumenti i preuzimanja
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Tehnički podaci
| Temperatura razmekšavanja (Tg) | 110.0 °C |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
LOCTITE® ABLESTIK 3119
LOCTITE ABLESTIK 3119, Epoxy, Bonding