LOCTITE® ABLESTIK 3119

Omadused ja eelised

TDS-i allalaadimine
LOCTITE ABLESTIK 3119, Epoxy, Bonding
LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive. Please refer to the TDS for alternate cure schedules.
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Dokumendid ja allalaadimised

Tehniline andmeleht
LOCTITE® ABLESTIK 3119
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Tehniline teave

Klaasistumistemperatuur (Tg) 110.0 °C
Tahkumistüüp Kuumkõvenemine