BERGQUIST® GAP PAD® TGP A2000

Poznat kao Gap Pad® A2000

Elementi i pogodnosti

BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material
BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, BERGQUIST GAP PAD TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
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Dokumenti i preuzimanja

Tehnički podaci

Boja Siva
Jangov modul, ASTM D575 379.0 KPa (55.0 psi )
Otpornost na plamen V-0
Radna temperatura -60.0 - 200.0 °C
Standardna debljina 0.254 - 1.016 mm
Tip nosača Staklena vuna
Toplotna provodljivost 0.2 W/mK