BERGQUIST® GAP PAD® TGP A2000
Known as Gap Pad® A2000
Features and Benefits
BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material
BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, BERGQUIST GAP PAD TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
- Thermal Conductivity: 2.0 W/m-K
- Fiberglass reinforced for puncture, shear and tear resistance
- Electrically isolating
Documents and Downloads
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Technical Information
| Carrier type | Fiberglass |
| Color | Gray |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Standard thickness | 0.254 - 1.016 mm |
| Thermal conductivity | 0.2 W/mK |
| Young's modulus, ASTM D575 | 379.0 KPa (55.0 psi ) |
BERGQUIST® GAP PAD® TGP A2000
BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material